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Team:EPF-Lausanne/ Microfluidics
From 2008.igem.org
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Contents |
Microfluidics
Methods
Chip design and functionality
Molds fabrication - Clean room
Molds were fabricated at the [http://cmi.epfl.ch Center of MicroNanoTechnology at EPFL (CMI)] on silicon wafers. The flow wafers were coated with the AZ9260 positive resist at a thickness of 8um and the control wafers were coated with SU-8 negative photoresist at a thickness of 10um. SU-8 has the advantage to be more resistant and more stable than the positive resist. But, AZ9260 has the advantage that it can be rounded when baked and this property allows to have a better closing ability of the flow channels by the control valves. On the meantime, masks corresponding to the design were written using a laser pattern generator (Heidelberg DWL200). These masks were used to expose the wafers
PDMS chip
Cell patterning on chip
MITOMI
--> add link to protocols
